Out Of Stock
GIGABYTE X670E AORUS XTREME DDR5 AMD AM5 E-ATX Motherboard
- Supported CPU: Ryzen 7000 Series Processors for Socket AM5
- Supported RAM: 4x DDR5, Max 128GB
- Graphics Output: 1 x HDMI, 1 x DisplayPort
- Features: Marvell AQtion 10GbE LAN & Intel Wi-Fi 6E 802.11ax
- Stock: Out Of Stock
- Brand: GIGABYTE
- Model: Model: X670E AORUS XTREME
৳0.00
Ex Tax: ৳0.00
Basic Information | |
BIOS | 1 x 256 Mbit flash Use of licensed AMI UEFI BIOS PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0 |
Chipset | AMD X670 |
Form Factor | E-ATX Form Factor; 30.5cm x 26.9cm |
Supported CPU | AMD Socket AM5, support for : AMD Ryzen 7000 Series Processors |
Connector & Ports | |
Audio | 2 x audio jacks |
HDMI | 1 x HDMI port |
Internal I/O Ports | 1 x 24-pin ATX main power connector 2 x 8-pin ATX 12V power connectors 1 x CPU fan header 1 x water cooling CPU fan header 4 x system fan headers 4 x system fan/water cooling pump headers 2 x addressable LED strip headers 2 x RGB LED strip headers 1 x CPU cooler LED strip/RGB LED strip header 4 x M.2 Socket 3 connectors 6 x SATA 6Gb/s connectors 1 x front panel header 1 x front panel audio header 1 x USB Type-C header, with USB 3.2 Gen 2x2 support 2 x USB 3.2 Gen 1 headers 2 x USB 2.0/1.1 headers 1 x noise detection header 1 x THB_U4 add-in card connector 1 x power button 1 x reset button 2 x temperature sensor headers 1 x reset jumper 1 x Clear CMOS jumper Voltage Measurement Points |
LAN Port (s) | Marvell AQtion AQC113C 10GbE LAN chip (10 Gbps/5 Gbps/2.5 Gbps/1 Gbps/100 Mbps) |
RAID | RAID 0, RAID 1, and RAID 10 support for NVMe SSD storage devices RAID 0, RAID 1, and RAID 10 support for SATA storage devices |
Supported Storage | CPU: 1 x M.2 connector (Socket 3, M key, type 25110/2280 PCIe 5.0* x4/x2 SSD support) (M2A_CPU) * Actual support may vary by CPU. 3 x M.2 connectors (Socket 3, M key, type 22110/2280 PCIe 5.0* x4/x2 SSD support (M2B_CPU/M2C_CPU/M2D_CPU) * Actual support may vary by CPU. Chipset: 6 x SATA 6Gb/s connectors |
TPM (Trusted Platform Module ) | 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only) |
USB (s) | CPU: 1 x USB Type-C port on the back panel, with USB 3.2 Gen 2 support 2 x USB 3.2 Gen 2 Type-A ports (red) on the back panel CPU + USB 2.0 Hub: 4 x USB 2.0/1.1 ports on the back panel Chipset: 2 x USB Type-C ports, with USB 3.2 Gen 2x2 support (1 port on the back panel, 1 port available through the internal USB header) 4 x USB 3.2 Gen 2 Type-A ports (red) on the back panel 4 x USB 3.2 Gen 1 ports available through the internal USB headers 4 x USB 2.0/1.1 ports available through the internal USB headers |
Wireless Communication module | Wireless Communication module Intel Wi-Fi 6E AX210 WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands BLUETOOTH 5.3 Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate (Actual data rate may vary depending on environment and equipment.) |
Expansion Slots | |
PCI | CPU: 1 x PCI Express x16 slot, supporting PCIe 5.0* and running at x16 (PCIEX16) * Actual support may vary by CPU. * The M2B_CPU and M2C_CPU slots share bandwidth with the PCIEX16 slot. When the M2B_CPU or M2C_CPU slot is populated, the PCIEX16 slot operates at up to x8 mode. * For optimum performance, if only one PCI Express graphics card is to be installed, be sure to install it in the PCIEX16 slot. Chipset: 1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x4 (PCIEX4) 1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x2 (PCIEX2) Support for AMD CrossFire technology (PCIEX16 and PCIEX4) |
Graphics | |
Graphics | Integrated Graphics Processor: 1 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz * Support for HDMI 2.1 version and HDCP 2.3. ** Support native HDMI 2.1 TMDS compatible ports. 1 x DisplayPort, supporting a maximum resolution of 3840x2160@144 Hz * Support for DisplayPort 1.4 version and HDR. |
Memory | |
Maximum Memory | Up to 128 GB (32 GB single DIMM capacity) of system memory |
Slots | 4 DIMMs |
Supported Memory | Support for DDR5 6600(OC) / 6400(OC) / 6200(OC) / 6000(OC) / 5600(OC) / 5200 / 4800 / 4400 MT/s memory modules Dual channel memory architecture Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules Support for AMD EXtended Profiles for Overclocking (AMD EXPO™) and Extreme Memory Profile (XMP) memory modules |
Type | DDR5 |
Others | |
Bundled Software | Norton Internet Security (OEM version) LAN bandwidth management software |
Special Features | Support for GIGABYTE Control Center (GCC) * Available applications in GCC may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications. Support for Q-Flash Support for Q-Flash Plus Support for Smart Backup |
Warranty Information | |
Manufacturing Warranty | 3 Years |
GIGABYTE X670E AORUS XTREME DDR5 AMD AM5 E-ATX Motherboard
The GIGABYTE X670E AORUS XTREME Motherboard supports AMD Ryzen 8000 & 7000 Series Processors for AMD socket AM5. It can deliver unparalleled performance with direct 18+2+2 Phases Digital VRM Solution. The GIGABYTE X670E AORUS XTREME comes with 4x SMD DIMMs with AMD EXPO & Intel XMP Memory Module Support. It supports DDR5 6600(OC) / 6400(OC) / 6200(OC) / 6000(OC) / 5600(OC) / 5200 / 4800 / 4400 MT/s memory modules. It features 4x PCIe 5.0 x4 M.2 Connectors for next-generation storage. It has a Fins-Array III & M.2 Thermal Guard III to Ensure VRM Power Stability & 25110 PCIe 5.0 M.2 SSD Performance. The new generation Fins-Array III delivers the ultimate thermal performance by using Extended Irregular fins to fill all available space and vastly increases surface area. A piece of Fins-Array III heatsink surface area is larger than 2 full-size ATX motherboard PCBs, therefore it tremendously boosts thermal efficiency and heat exchange performance. It also comes with SMD PCIe 5.0 x16 Slot & M.2 Connectors with Quick Release & Screwless Design. M.2 Thermal Guard III is constructed with a 9X optimized heat dissipation surface to prevent throttling and bottleneck that the high-speed/ large capacity of PCIe 5.0 M.2 SSDs may cause, especially under a heavy workload. The special design of heatsink grooves in the direction of the CPU further enhances the in-chassis air flow and optimizes the heat convection efficiency. The GIGABYTE X670E AORUS XTREME Motherboard is equipped with the latest Wireless solution 802.11ax Wi-Fi 6E with a new dedicated 6GHz band, enables gigabit wireless performance, provides smooth video streaming, better gaming experience, few dropped connections, and speeds up to 2.4Gbps. Moreover, Bluetooth 5 provides a 4X range over BT 4.2 and faster transmission. The GIGABYTE X670E AORUS XTREME comes with 3 years warranty.